High capacity silicon photonics packaging

Angelica Simbula;
2019-01-01

Abstract

A large amount of progress has been made in the industrialization of Silicon Photonics fabricated in CMOS Fabs, enabling the adoption of 100G QSFP modules. Further progress has now increased the transmission capacity of Silicon Photonics devices. In this paper, we outline the package design and evaluation of high capacity Silicon Photonics devices from simulation of the package performance to the prototype packaging results.
2019
Inglese
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
978-0-9568086-6-0
Institute of Electrical and Electronics Engineers
8
WOS:000532694100076
2-s2.0-85078850482
22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
Contributo
Comitato scientifico
16-19 Settembre 2019
Pisa, Italia
internazionale
scientifica
Packaging; Silicon photonics
no
4 Contributo in Atti di Convegno (Proceeding)::4.1 Contributo in Atti di convegno
Binda, Marco; Canciamilla, Antonio; Daverio, Alessio; Fincato, Antonio; Gambini, Piero; Maggi, Luca; Orlandi, Piero; Ramini, Luca; Repossi, Matteo; Si ...espandi
273
11
4.1 Contributo in Atti di convegno
reserved
info:eu-repo/semantics/conferencePaper
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