From automotive to space qualification: Overlaps, gaps and possible convergence

Vaion, R. Enrici;Medda, M.;Mancaleoni, A.;Mura, G.

2018-01-01

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Abstract

The pervasive employment of microelectronics in the Automotive application is mostly based on its successful qualification approach and screening methodology for such harsh environments, and secondly driven by market needs. Automotive trends have become more and more challenging in terms of reliability targets. As a consequence, the qualification activity has evolved, passing from a stress-driven approach strictly based on AEC-QlOO standard to a failure mode driven approach oriented to satisfy the robustness criteria required by TIER1 and Car Makers. It is indeed for the demonstrated reliability of advanced CMOS ICs and smart power devices that we can even think of an automated car driving in the next future. At the same time, the Aerospace market has always chosen an high level- reliability solutions through customized technologies and processes, in order to cope with the requirement driven by mission profiles and application environment severity. Space technology evolution towards clusters and constellations of small satellites calls for more and more high reliable microelectronics on board. It is possible to state that Aerospace and Automotive worlds are converging in terms of reliability approach fundamentals. This paper aims at showing how close IC qualification for Automotive is to Space requirements. Moreover, it shows the possibility to bring high- reliability electronics from the high-production, well screened Automotive market to the low-production, high price Aerospace market. Overlaps, gaps and possible convergence will be pointed out.